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Nanoparticle engineering for chemical-mechanical planarization : fabrication of next-generation nanodevices

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Increasing reliance on electronic devices demands products with high performance and efficiency. Such devices can be realized through the advent of nanoparticle technology. This book explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarization (CMP) process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. This comprehensive text also presents design techniques using polymeric additives to improve CMP performance.

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Detail Information

Series Title

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Call Number

621.38152. JEA

Publisher

Frankfurt : Taylor & Francis., 2009

Collation

xi. :ill. : 222 p.

Language

ISBN/ISSN

1100491609

Classification

621.38152.

Content Type

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Media Type

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Carrier Type

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Edition

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Subject(s)

Technology
Nanoparticles
Chemical mechanical planarization
Nanoelectronics
Semiconductors--Design and construction

Specific Detail Info

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Statement of Responsibility

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