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Found 1 from your keywords: subject="Chemical mechanical p...
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cover
Nanoparticle engineering for chemical-mechanical planarization : fabrication …
Paik, UngyuPark, JeaGun

Increasing reliance on electronic devices demands products with high performance and efficiency. Such devices can be realized through the advent of nanoparticle technology. This book explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarization (CMP) process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolati…

Edition
-
ISBN/ISSN
1100491609
Collation
xi. :ill. : 222 p.
Series Title
-
Call Number
621.38152. JEA